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INTERPACK PROCESSES AND PACKAGING LEADING TRADE FAIR

    Hatzopoulos participated again in the world’s leading packaging trade fair. This is the major event for the packaging industry and all related process technologies.

    2.700 exhibitors from more than 60 countries presented their latest ideas, innovative concepts and technological visions at interpack
    – not only in equipment and machinery for packaging and processing, but also in production tools for packaging materials, materials themselves and services for the entire industry.

    During the show which took place from 08 until 14th of May 2014, we presented innovative packaging solutions such as:
    §X-Laser Cut,
    §X-Code
    §Our full range of high barrier packaging solutions as well as retortable and aseptic packaging films.